S2C adds 9 New Prototype Ready™ Accessories to its Rapid SoC Prototyping Environment
Sep 12, 2011

S2C adds 9 New Prototype Ready™ Accessories to its Rapid SoC Prototyping Environment

Prototype Ready Accessories Shorten the Prototype Development Time

San Jose, CA – September 12, 2011 – S2C announced that it has added 9 new Prototype Ready accessories to its broad portfolio of Prototype Ready: accessories, reference designs and IP. These Prototype Ready pre-engineered solutions accelerate the prototype development time by giving the designer a broad array of choices on how to implement the prototype and how to interface the prototype to the actual operating environment.

Mon-Ren Chene, Chairman and CTO of S2C said: “our focus is on giving our customer the building blocks to rapidly create SoC prototypes. We pride ourselves in working closely with our customers and in adding products to our portfolio to meet our customer’s special requirements.  Many of these new Prototype Ready accessories were developed to meet specific customer needs."

The 9 new accessories fall in 3 different categories.

1. General Peripheral Modules

D-Max Interface Module - convenient debugging using external Tektronix Logic Analyzer to monitor I/O signals on TAI LM. It has 8 switches, 8 LED, 3 push buttons and many jumper pins.

2 Channel PCIe x8 Gen2 Root Complex Module - equipped with an Altera Stratix-4 180GX FPGA device and has 2 PCIe Gen2 8-lane Root Port Slot (16 SerDes), one  SATA2.0 interface and one Gigabit transceivers through SMA connectors.  The module also has 4 TAI Logic Module IO connectors supplying up to 480 general purpose I/O that can be served as an extension for S2C TAI Logic Module users thorough stacking or cabling.

2. General Expansion Modules

TAI LM Interconnection Module Type A - connects 2 horizontally aligned TAI LM connectors

TAI LM Interconnection Module Type B - connects 2 vertically aligned TAI LM connectors and provides 2 clocks input through OSC sockets and 1 push-button reset.

Alternative Quad V6 Conversion Package - converts 2 S2C Dual Virtex-6 TAI Logic Module to a 4 FPGA SoC/ASIC Prototyping platform. The package includes 6 TAI LM Interconnection Modules (4 P-IMA and 2 P-IMB) and an Acrylic Mother Board to fix the position of 2 TAI LM and daughter boards for a physically robust system.

Connector Spacer Module - adds height between a TAI LM I/O Terminal Connector and a TAI Logic Module I/O Socket connector.

Virtex-6 I/O Level Shifting Module - allows Virtex-6 TAI LM 2.5V I/O to connect to 3.3V devices.

3. Memory Modules

2 Channel 128 MB NOR Flash Memory Module - provides 2 channels of 128M bytes of external NOR flash Memory for TAI Logic Module and is configured as 2 channels of 64M x 16 bits.

4. Multimedia Modules

VGA Interface Module - Provides one DB25 VGA interface which supports up to 1600x1200 resolution @100MHz.

Availability

All of these new Prototype Ready accessories are available today.

試作検証プランを入手

どのタイプのチップを設計していますか?
設計に含まれるASICゲートの容量は?
500万~2000万
2,000万~5,000万
5000万~1億
1億~10億
10億以上
どのFPGAを使いたいですか?
ザイリンクス VU440
ザイリンクス KU115
ザイリンクス VU19P
ザイリンクス VU13P
ザイリンクス VU9P
インテル S10-10M
インテル S10-2800
わからない、専門家のアドバイスが必要
どのようなFPGA構成が必要ですか?
シングルFPGA
デュアルFPGA
4 つの FPGA
8つのFPGA
わからない、専門家のアドバイスが必要
どのような周辺機器インターフェースが必要ですか?
プロトタイプ検証プラットフォームはいくつ必要ですか?
以下のツールが必要ですか?
セグメンテーションツール
複数の FPGA デバッグ ツール
コモデリング ツール (FPGA と PC ホスト間で大量のデータをやり取りできます)
当社の製品をいつ使用する必要がありますか?
0~6ヶ月
6-12ヶ月
12ヶ月以上
わからない
その他
参加する
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